LPKF receives purchase LOI from leading Asian advanced semiconductor packaging manufacturer, confirming equipment selection for production ramp-up
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EQS-Ad-hoc: LPKF Laser & Electronics SE / Key word(s): Significant contracts
Ad hoc-Announcement - Inside information pursuant to Article 17 MAR LPKF receives purchase LOI from leading Asian advanced semiconductor packaging manufacturer, confirming equipment selection for production ramp-up Garbsen, 23 September 2026 – LPKF Laser & Electronics SE has received a Letter of Intent (LOI) from a leading Asian advanced semiconductor packaging manufacturer for the purchase of its NEXAR LIDE glass processing systems, confirming the selection of LPKF in the equipment stack. The customer plans to use the systems for the initial ramp-up of its glass substrate production facility for high-performance advanced packaging solutions. The letter confirms the intent to purchase equipment in the mid-single-digit million euro range, with the order expected shortly. The project supports LPKF’s growth strategy in glass-based advanced packaging for high-performance computing and AI applications.
Contact: Bettina Schäfer, Department Manager Group Communication & Investor Relations End of Inside Information
23-Sep-2026 CET/CEST The EQS Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. |
| Language: | English |
| Company: | LPKF Laser & Electronics SE |
| Osteriede 7 | |
| 30827 Garbsen | |
| Germany | |
| Phone: | +49 (0) 5131 7095-0 |
| Fax: | +49 (0) 5131 7095-95 |
| E-mail: | investorrelations@lpkf.com |
| Internet: | www.lpkf.com |
| ISIN: | DE0006450000 |
| WKN: | 645000 |
| Indices: | SDAX |
| Listed: | Regulated Unofficial Market in Hamburg, Stuttgart, Tradegate BSX |
| LEI Code: | 529900BCQXUJL7J96G45 |
| EQS News ID: | 2404032 |
| End of Announcement | EQS News Service |
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2404032 23-Sep-2026 CET/CEST
